Ultrasonically bonded multilayer form and methods of making same

ABSTRACT

The invention provides a water blocking tape for use in a variety of cable designs, such as power cable, data communications cable and telecommunications cable. A water blocking tape according to the invention includes layers of lightweight nonwoven fabric with one or more swellable water blocking compounds, such as water absorbent polymers, disposed between the layers. The nonwoven fabric layers are bonded in a pattern using an ultrasonic bonding technique. The bonding pattern helps to contain and to restrain movement of the water blocking compounds between the layers. The bonding pattern compartmentalizes the water blocking compounds to prevent pooling of the compounds and to facilitate a substantially consistent distribution of the compounds between the layers such that when a tape contacts water, the tape achieves a substantially consistent swell height. A substantially consistent swell height permits a tape to serve as a reliable water barrier to prevent damage and degradation of a cable and its components. Ultrasonic bonding of the multilayer tape eliminates the need and use of adhesives and bonding agents to form the tape that can have inhibiting effects on a swelling action of the tape. The invention further provides a multilayer form or substrate produced using an ultrasonic bonding technique and having disposed between adjacent layers one or more non-fluid compounds that have one or more physical properties or characteristics, such as, for instance, odor-absorbing properties, heat absorbing properties, humidity or moisture absorption properties, fragrant properties, thermal properties, as well as any of other required or desired physical properties or characteristics.

PRIOR PATENT APPLICATION

[0001] This application is a continuation-in-part application within 37C.F.R. § 1.53(b) of U.S. nonprovisional patent application Ser. No.10/440,207, filed May 16, 2003, which is incorporated herein byreference.

FIELD OF THE INVENTION

[0002] The invention is directed generally to a nonwoven water blockingtape for use with power, data communications and telecommunicationscables. In addition, the invention is further directed to a multilayerform or substrate produced using an ultrasonic bonding technique havingone or more compounds disposed between layers that provide certainphysical properties or characteristics.

BACKGROUND OF THE INVENTION

[0003] Underground cable systems including power (energy) cables or datacommunications and telecommunications cables are invariably susceptibleto damage and degradation caused by infiltration and migration of waterinto cable cores. Water is particularly hazardous to fiber optic cable,causing long-term reduction in transmission reliability and outrighttransmission failure.

[0004] Fiber optic cables are susceptible to water damage due to, forinstance, mechanical damage to an outer cable jacket or a sheathingsystem that allows water to penetrate into a central core or buffertubes containing optical fibers. Exposure of optical fibers to watercauses microbending wherein water near or surrounding the optical fibersfreezes and stresses the structure of the optical fibers, causingoptical fibers to bend. Microbending degrades optical fibers andincreases losses of signal transmission. Changes in ambient conditionsalso expose optical fibers to moisture. Such changes create differentvapor pressures inside and outside a cable jacket that cause moisture todiffuse through the jacket into a central core or group of buffer tubes,exposing the optical fibers to undesirable moisture.

[0005] Many cable products are provided with one or more forms of waterblocking 25 protections to prevent ingress and migration of water. Priorart water blocking protections are incorporated with cables in variousforms including waterproof jackets, water blocking layers incorporatedbetween a central core and a core or jacket, water blocking yarns, waterblocking tapes, and combinations thereof. Such water blockingprotections impart water blocking capabilities to underground cable toprevent water penetration through cable sheathing systems toward centralcore areas, e.g., containing optical fibers, and to prevent furtherdamage caused by water migration along cable axes. Prior art waterblocking tapes are often disposed between a central core and a sheathingsystem or outer cable jacket. For instance, U.S. Pat. No. 6,173,100discloses a water blocking tape disposed between a core and an outerjacket. The tape includes two or more layers of material with fibers.The fibers form a matrix for bonding with and retaining superabsorbentpolymers applied to the layers. U.S. Pat. No. 5,642,452 discloses afiber optic cable including a water blocking system comprising aprotective layer with water swellable characteristics disposed between acore and a jacket. The cable also includes one or more water blockingyarns with swellable characteristics that extend longitudinally alongthe cable. The blocking yarns and the protective layer are treated witha superabsorbent compound, such as polyacrylic acid, to impart swellingcharacteristics to the yarns and the protective layer beforeincorporation with the cable.

[0006] Other prior art water blocking protections include strengthmembers treated with water absorbing compounds. U.S. Pat. No. 5,163,115discloses a water blocking member treated with a saline-tolerant,temperature-resistive superabsorbent polymer. European Publication No. 0314 991 Bi discloses a substrate member disposed between an innercentral core containing optical fibers and a plastic cable jacket thatis impregnated with a film or a paste of a water swelling orsuperabsorbent material, such as polyacrylic acid or polyacrylamide.European Publication No. 0 827 625 Bi discloses a water blockingcomposite impregnated with or having a coating of a mixture of aradiation polymerized 20 compound and a water swellable compound.

[0007] Layered water blocking tapes are, however, susceptible to“fall-out” or loss of water blocking compounds contained between layersof material during cable manufacture. For certain applications, waterblocking tapes and materials must be sufficiently thin and flexible foruse, for instance, with certain cable designs, such as fiber 25 opticcable. Such tape configurations can limit the amount of water absorbentcompounds that may be loaded between layers of material. Multilayerwater blocking tapes are often sealed or bonded with adhesives andbonding agents, and, in some cases, are necessary for containment ofwater blocking compounds. Such adhesives and bonding agents can inhibitthe swelling action of water blocking compounds when contacted by waterand can limit the extent to which water blocking tapes may swell andincrease in thickness, compromising the tapes water protectionproperties.

[0008] Thus, a water blocking tape is desirable that can overcome atleast some limitations of multilayer tapes. In addition, a waterblocking tape configured to contain one or more water absorbentcompounds sufficient to provide a required swell height is desirable. Awater blocking tape is also desirable that provides a substantiallyconsistent distribution of one or more water absorbent compounds betweenlayers to ensure consistent swell height. Forming a water blocking tapewithout use of adhesives and/or bonding agents is also desirable to helpto maximize the tape's swelling action and swell height. A waterblocking tape that is lightweight and has sufficient flexibility for usewith certain cable designs, such as fiber optic cable, is desirable.

SUMMARY OF THE INVENTION

[0009] In general, in an aspect, the invention provides an improvedwater blocking tape for use with cable. In another aspect, the inventionprovides a multilayer water blocking tape having two or more layers ofmaterial bonded in a pattern. The pattern helps to prevent migration orto restrain movement of one or more water absorbent compounds disposedbetween layers. A further aspect of the invention provides an improvedsystem and method of forming a water blocking tape using ultrasonicbonding and ultrasonic cutting techniques that eliminate use ofadhesives and bonding agents.

[0010] In general, in another aspect, the invention provides amultilayer form or substrate for use in any of a variety ofapplications. The invention provides a multilayer form or substrateconstructed, for instance, of a nonwoven material, and containingbetween at least adjacent layers of material one or more non-fluidcompounds having one or more properties or characteristics, such as, forinstance, odor-absorption or heat absorption properties. An ultrasonicbonding technique is used to bond or fuse two or more layers of themultilayer form or substrate along a pattern such that the one or morecompounds are disposed and contained between the layers. The patterndefines a configuration or array across at least a portion of themultilayer form or substrate that helps to restrain movement of the oneor more compounds disposed between the layers. The one or more non-fluidcompounds can include any of a variety of compounds including granular,particulate or powder materials, as well as pastes and semi-solidmaterials, that provide one or more required or desired properties orcharacteristics for use in one or more particular applications. Further,the multilayer form or substrate can define a range of dimensions, e.g.,length or width, for use in any of a number of applications.

[0011] In one aspect, the invention provides a water blocking tapecomprising a first layer of material; one or more water blockingcompounds disposed on a surface of the first layer of material; and asecond layer of material disposed on the one or more water blockingcompounds such that the water blocking compounds are disposed betweenthe first layer and the second layer of material, wherein the firstlayer and the second layer are bonded ultrasonically to one anotheralong a pattern traversing a surface of at least a portion of the firstlayer and the second layer to contain and to restrain movement of theone or more water blocking compounds between the first layer and thesecond layer.

[0012] Implementations of the invention may include one or more of thefollowing features. The one or more water blocking compounds arecompartmentalized by the pattern such that the one or more waterblocking compounds are disposed substantially consistently between thefirst layer and the second layer. When the tape contacts water, the tapeswells to a substantially consistent swell height.

[0013] Implementations of the invention may also include one or more ofthe following. The pattern includes a repeating and substantiallyuniform pattern. The repeating and substantially uniform patternincludes a pattern of similar diamond shapes, each diamond shape beingsized at about 1.6 cm by 1.6 cm. The first layer of material includes anonwoven material. The second layer of material includes a nonwovenmaterial. The first layer of material has substantially similardimensions as the second layer of material. The nonwoven material isselected from the group consisting of a spun bonded nonwoven fabric, aspun bonded melt blown spun bonded nonwoven fabric, a spun bonded meltblown melt blown spun bonded nonwoven fabric, a melt blown nonwoven, anonwoven nylon, a carded nonwoven fabric, a plastic, a polyester,polyethylene terephthalate, and combinations thereof. The nonwovenmaterial has a weight from about 10 grams per square meter (gsm) toabout 40 gsm.

[0014] The one or more water blocking compounds includes one or moreswellable water absorbent compounds. The one or more water blockingcompounds is selected from the group consisting of polyacrylate,polyacrylamide, polyvinyl alcohol, copolymer of polyacrylate,polyacrylamide, polyvinyl alcohol, copolymer of polyacrylate andpolyacrylamide, copolymer of polyacrylate and polyvinyl alcohol,copolymer of polyacrylamide and polyvinyl alcohol, and combinationsthereof. The one or more water blocking compounds are disposed at aloading weight of from about 10 gsm to about 50 gsm.

[0015] The tape further comprises at least one layer of a shieldingmaterial disposed directly on a surface of one of the first layer andthe second layer and ultrasonically bonded thereto along the pattern.

[0016] In another aspect, the invention provides a method of forming awater blocking tape comprising providing a first sheet of material;dispensing one or more water blocking compounds on a surface of thefirst sheet of material; disposing a second sheet of material on thesurface of the first sheet of material such that the one or more waterblocking compounds are disposed between the first sheet and the secondsheet to form a web; impinging at least a portion of a first surface ofthe web with ultrasonic waves; and printing a pattern on at least aportion of a second surface of the web, wherein the first sheet and thesecond sheet of material are bonded therethrough along the pattern.

[0017] Implementations of the method according to the invention mayinclude one or more of the following features. Impinging at least aportion of the first surface of the web with ultrasonic waves includesimpinging at least a portion of the first surface of the web withultrasonic waves at substantially a same time as printing the pattern onat least a portion of the second opposite surface of the web. Theportion of the first surface of the web impinged by ultrasonic waves isopposite to the portion of the second surface of the web printed withthe pattern. The pattern traverses at least a portion of a width of theweb. The pattern includes a repeating and substantially uniform pattern.Portions of the one or more water blocking compounds arecompartmentalized by the pattern such that the one or more water blockcompounds are disposed substantially consistently between the firstsheet of material and the second sheet of material.

[0018] Impinging the first surface of the ultrasonically bonded web withultrasonic waves and contacting the second surface of the web with oneor more cutting devices such that the cutting devices slit the webtherethrough into one or more strips. Impinging the first surface of theultrasonically bonded web with ultrasonic waves includes impinging thefirst surface of the ultrasonically bonded web at substantially a sametime as the one or more cutting devices contacts the second surface ofthe web. A portion of the first surface of the web impinged byultrasonic waves is opposite to an area of the second surface of the webcontacted by the one or more cutting devices.

[0019] In a further aspect, the invention provides a system for forminga water blocking tape comprising a first conveying mechanism to supply afirst layer of material, the first conveying mechanism disposed andconfigured to convey the first layer of material along an axis; adispensing device disposed along the axis and configured to dispense oneor more water blocking compounds on a first surface of the first layerof material as the first layer of material is conveyed past thedispensing device; a second conveying mechanism disposed along the axisdownstream from the dispensing device to supply a second layer ofmaterial, the second conveying mechanism being disposed and configuredto convey the second layer of material along the axis such that thesecond layer of material becomes disposed on the one or more waterblocking compounds, wherein the first layer and the second layer ofmaterial form a web with the one or more water blocking compoundsdisposed therebetween; and an ultrasonic lamination device disposedalong the axis downstream from the second conveying mechanism, theultrasonic lamination device being disposed and configured to emitultrasonic waves that impinge a first surface of the web and to print apattern on a second surface of the web as the web is conveyed past theultrasonic lamination device to bond the first layer of material to thesecond layer of material along the pattern.

[0020] Implementations of the system according to the invention mayinclude one or more of the following features. The ultrasonic laminationdevice includes a first ultrasonic horn configured to emit ultrasonicwaves and a printing device configured to print the pattern. The firstultrasonic horn and the printing device are disposed on opposite sidesof the axis and are aligned to one another such that the web is conveyedbetween the first ultrasonic horn and the printing device. The firstultrasonic horn is configured to impinge the first surface of the web atsubstantially the same time as the printing device prints the pattern onthe second surface of the web. The printing device is a roller havingthe pattern defined in its surface.

[0021] Implementations of the system according to the invention may alsoinclude one or more of the following features. The system furthercomprises an ultrasonic cutting device disposed along the axisdownstream from the ultrasonic lamination device, the ultrasonic cuttingdevice being disposed and configured to emit ultrasonic waves thatimpinge the first surface of the web and to slit the web therethroughfrom the second surface of the web to cut the web into multiple strips.The ultrasonic cutting device includes a second ultrasonic hornconfigured to emit ultrasonic waves and one or more cutting devicesconfigured to slit the web. The second ultrasonic horn and the one ormore cutting devices are disposed on opposite sides of the axis and arealigned to one another such that the web is conveyed between the secondultrasonic horn and the one or more cutting devices. The secondultrasonic horn is configured to impinge the first surface of the web atsubstantially the same time as the one or more cutting devices slit thesecond surface of the web and cut the web therethrough into multiplestrips.

[0022] Implementations of the system according to the invention canfurther include a take-up device disposed along the axis downstream fromthe ultrasonic cutting device and being configured to wind the multiplestrips of the web thereto.

[0023] Various aspects of the invention may provide one or more of thefollowing advantages. A water blocking tape for use with different typesof cable designs can be provided that includes one or more waterblocking compounds for providing water absorption properties to a cableand for preventing water damage and degradation of a cable. A waterblocking tape can be provided having a configuration for use with one ormore cable components, e.g., a cable core, one or more protective layerssurrounding a cable core, a sheathing system, a strength system havingone or more strength members or rods or other protective components usedin a cable. One or more of the water blocking compounds can include oneor more water absorbent compounds, e.g., superabsorbent polymers.

[0024] Using ultrasonic bonding techniques, a multilayer water blockingtape can be formed without use of adhesives and bonding agents that, forinstance, can inhibit or mask a swelling action of a water blockingcompound disposed between layers of a tape when the compound contactswater. A lack of adhesives and bonding agents can help to maximize apotential swell volume of one or more water blocking compounds and canthereby help to maximize a potential swell height of a water blockingtape. Without use of adhesives and bonding agents to form a waterblocking tape, a desired swell rate of water absorbent compounds can beachieved to provide a rapid response to penetration of water into acable.

[0025] An ultrasonic bonding technique can be used to bond or fuse twoor more layers of material, such as a nonwoven fabric, along a desiredpattern such that water blocking compounds disposed between the layersare contained or compartmentalized by the pattern. The bonding patterncan define configurations and shapes to contain water blocking compoundsand thereby to restrain movement and prevent migration and pooling ofthe water blocking compounds between the layers of material. Such abonding pattern can help to facilitate a substantially consistentdistribution of water blocking compounds between layers of a tape. Asubstantially consistent distribution of water blocking compoundsthroughout a tape can produce a substantially consistent swell height ofa tape when the tape contacts water. A substantially consistent swellheight of a water blocking tape can help to form a reliable waterbarrier in a cable that helps to prevent water infiltration into a cablecore and water migration along a span of a cable.

[0026] Ultrasonically bonding a multilayer water blocking tape in apattern can also help to prevent or at least reduce “fall-out” of waterblocking compounds disposed between layers during cable manufacture.Reducing “fall-out” can help to ensure a sufficient amount of waterblocking compound contained between layers of a tape to provide adequatewater absorption and water blocking ability of the tape.

[0027] Nonwoven fabrics can be used to construct a multilayer waterblocking tape having sufficient strength to withstand cablemanufacturing processes, while being lightweight such that the tape doesnot add weight to a cable. Nonwoven fabrics can provide a flexiblemultilayer water blocking tape particularly suited for use with, forinstance, fiber optic cable. Nonwoven fabrics can include relativelyinexpensive materials to form an economical multi layer tape. Otherlayers of different materials having specific properties, such as heatshielding properties, can be incorporated into a multi layer waterblocking tape by ultrasonic bonding such layers.

[0028] Ultrasonic bonding and ultrasonic cutting techniques can be usedin a system and method of producing multiple tapes from a multilayer webof nonwoven fabric having one or more water blocking compounds disposedbetween the layers. A continuous inline system and method usingultrasonic bonding and ultrasonic cutting techniques can form from asingle production run one or more multilayer water blocking tapes fromthe web having desired dimensions for use in more than one applicationor cable design.

[0029] These and other advantages of the invention, along with theinvention itself, will be more fully understood after a review of thefollowing figures, detailed description, and claims.

BRIEF DESCRIPTION OF THE DRAWINGS

[0030] For a better understanding of the present invention, reference ismade to the drawings, which are incorporated herein by reference and inwhich:

[0031]FIGS. 1a-1 b are cross-sectional views of one aspect of a waterblocking tape according to the invention.

[0032]FIGS. 2a-2 b are top views of the tape shown in FIG. 1a.

[0033]FIG. 2c is a cross-sectional view of the tape shown in FIGS. 2a-2b.

[0034]FIG. 3 is a top view of another aspect of the tape shown in FIG.1a.

[0035]FIGS. 4a-4 b are flow diagrams of methods of making the tape shownin FIGS. 2a-2 c and FIG. 3.

[0036]FIG. 5 is a cross-sectional flow diagram of a system and method ofmaking the tape shown in FIGS. 1a-1 b, FIGS. 2a-2 c and FIG. 3.

[0037]FIG. 6 is a cross-sectional view of one aspect of a multilayerform having one or more non-fluid compounds disposed between layersaccording to the invention.

[0038]FIG. 7 is a cross-sectional view of the multilayer form shown inFIG. 6.

[0039]FIG. 8 is a top view of the multilayer form shown in FIG. 6.

[0040]FIGS. 9a-9 b are flow diagrams of methods of making the multilayerform shown in FIGS. 6 through 8.

DETAILED DESCRIPTION OF THE INVENTION

[0041] The invention provides a water blocking tape for use with acable, such as a data communications cable, a telecommunications cable,or a power cable. The water blocking tape according to the inventiongenerally includes a first layer of nonwoven material disposed on asecond layer of nonwoven material with one or more swellable waterblocking compounds disposed between the first and the second layers. Thelayers are bonded in a pattern using ultrasonic bonding techniques. Thelayers are substantially simultaneously impinged with ultrasonic wavesand printed with a pattern to bond or fuse the layers along the linesand demarcations of the pattern. The bonding pattern helps to contain orto compartmentalize the water blocking components between the layers.When the tape is applied to a cable or integrated with one or more cablecomponents, the tape provides water blocking properties. Otherembodiments are within the scope of the invention.

[0042] Referring to FIGS. 1a-1 b, in a first embodiment, the inventionprovides a water blocking tape 10 including at least a first layer ofmaterial 20 disposed with at least a second layer of material 30, and atleast one water blocking compound 40 contained between the first and thesecond layers 20 and 30. In one embodiment, a layer of shielding, e.g.,heat shielding, material 35 can be disposed with at least one of thefirst layer 20 and the second layer 30 of nonwoven material, as shown inFIG. 1b. The invention, however, is not limited to the tape 10 shown inFIGS. 1a-1 b, but anticipates other configurations including additionallayers to achieve the multilayer tape 10.

[0043] In one embodiment, the first and the second layers 20 and 30 canbe constructed of a nonwoven material suitable for providing strength tothe tape 10 such that the tape 10 can withstand cable manufacturingprocesses. A suitable nonwoven material can include a lightweightmaterial or fabric that will not add significant weight to a cable. Anonwoven material or fabric suitable for constructing the first and thesecond layers 20 and 30 can include, but is not limited to, a spunbonded nonwoven, e.g., spun bonded polyester, a spun bonded melt blownspun bonded (SMS) nonwoven, e.g., SMS polypropylene, a spun bonded meltblown melt blown spun bonded (SMMS) nonwoven, a melt blown nonwoven, aspun bonded nonwoven, e.g., spun bonded polyurethane, a nonwoven nylon,a carded nonwoven and combinations thereof. In different embodiments ofthe invention, these materials may be preferred because they arecomparatively inexpensive and have flexibility to permit use of the tape10 with fiber optic cable. Such materials as nonwoven polypropylene ornonwoven polyester are commercially available from BBA Nonwovens,Simpson, S.C., and Kimberly Clark, Neenah, Wash.

[0044] In another embodiment, the first and/or the second layers 20 and30 can be constructed of a plastic or polyester layer or film, such aspolyethylene terephthalate (PET).

[0045] In one embodiment, the first and the second layers 20 and 30, canbe constructed, for example, of a spun bonded melt blown spun bonded(SMS) polypropylene nonwoven having a high tensile strength and lowporosity. The first and the second SMS polypropylene nonwoven layers canhave a weight of from about 10 grams per square meter (gsm) to about 40gsm, and preferably about 16 gsm to produce an economical tape 10.Heavier SMS polypropylene nonwovens are comparatively more expensivethan lighter polypropylene nonwovens.

[0046] Referring to FIGS. 2a-2 b, the first and the second layers ofnonwoven material 20 and 30 each has a width W₁ and W₂ that can be sizeddepending on an application or a cable design in which the tape 10 isused. As shown in FIG. 2b, in one embodiment, the first layer and thesecond layers 20 and 30 have widths W_(1 and W) ₂ that are substantiallysimilar. The first layer 20 (not shown) has essentially similardimensions, e.g., length and width, as the second layer 30. Longitudinaledges 20 a and 20 b of the first layer 20 are substantially even withlongitudinal edges 30 a and 30 b of the second layer 30. The resultingtape 10 according to the invention is not limited in width W₃ and can beconfigured for use in a variety of different applications and cabledesigns. For instance, in one embodiment, the tape 10 can have a widthW₃ of from about 10 mm to about 100 mm for use with or incorporatingwith one or more components of a fiber optic cable. In anotherembodiment, the tape 10 can include a relatively wide width W₃, e.g.,about 200 mm, for use with a power cable.

[0047] The shielding layer 35 can be constructed of a material suitablefor providing shielding properties, such as heat shielding, and/or otherproperties to one or more components of a cable in which the tape 10 isdisposed or integrated with. A suitable material includes, but is notlimited to, polyester and carbon-impregnated polyester.

[0048] As shown in FIGS. 1a-1 b, the tape 10 includes the water blockingcompounds 40 disposed between the first and the second layers 20 and 30.The compound 40 can include, but is not limited to, one or moreswellable, superabsorbent polymers referred to in the art as “SAPs”.SAPs include polymers having a capacity of absorbing water up to aboutone thousand times their weight in distilled water. Upon contact withwater, the SAPs absorb and bond with water molecules, thereby swellingand increasing in volume. When the tape 10 is incorporated within acable and/or with one or more of its components, the SAP 40 absorbswater upon contact and swells. The swollen tape 10 forms a physicalbarrier that helps to prevent or to at least reduce infiltration ofwater into the cable. The swelling action of the SAP 40 increases athickness or height of the tape 10 to a “swell height” such that thetape 10 can serve as a water barrier. The tape 10 can also help toprevent or to at least reduce migration of water along a length or spanof a cable.

[0049] SAPS are commercially available in a variety of forms, such assuperabsorbent 20 powders, fine particles, fine fibers or components ofwater blocking coatings. In one embodiment, the SAP 40 is asuperabsorbent polymer suitable for providing one or more of the waterblocking qualities noted above and can include, but is not limited to,polyacrylate, polyacrylamide, polyvinyl alcohol, copolymer ofpolyacrylate, polyacrylamide, polyvinyl alcohol, copolymer ofpolyacrylate and polyacrylamide, copolymer of polyacrylate and polyvinylalcohol, copolymer of polyacrylamide and polyvinyl alcohol, andcombinations thereof. Such SAPs 40 are available from a number ofmanufacturers including Sumitomo Seika of Japan.

[0050] The SAP 40 is disposed on a surface of at least one of the firstlayer of nonwoven material 20 and the second layer of nonwoven material30. As illustrated in FIGS. 1a-1 b, in one embodiment, the SAP 40 caninclude a powder form and can be dusted on the first layer 20. The SAP40 is disposed on the first layer 20 at a desired loading weight, whichin part can depend on an application or a cable design in which the tape10 is used. In one embodiment, the SAP 40 can be disposed at a loadingweight in a range of, although not limited to, from about 10 grams persquare meter (gsm) to about 50 gsm, and preferably about 20 gsm. Agreater loading weight of the SAP 40 can generally provide greater waterabsorption capacity of the tape 10. In one embodiment, the SAP 40 caninclude a percentage of a total weight of the tape 10 of from about 25%by weight of solids (% wt) to about 50% wt.

[0051] The type of SAP 40 and its loading weight (gsm) relate, in part,to a desired swelling ratio of the tape 10. The swelling ratio as usedherein refers to the extent or percentage by which the SAP 40 increasesin volume upon contact with water. A certain swelling ratio of the SAP40 may be required to achieve a desired swell height or thickness of thetape 10. In addition, a certain swell rate may be required to increasethe height of the tape 10 within a desired time upon contact with water.

[0052] For instance, in one embodiment, the tape 10 can be formed foruse with a fiber optic communications cable and can include at least oneSAP 40 in powder form, e.g., Sumitomo JP 550F provided by Sumitomo Seikiof Japan. The SAP 40 is loaded between the first and the second layersof nonwoven material 20 and 30 at a loading weight of about 20 gsm. TheSAP 40 includes about 30% wt of the total weight of the tape. The SAPhas a powder particle size of about 75 μm. Upon contact with water, theSAP 40 swells to about 95% of its maximum volume within about thirty(30) seconds, and increases height of the tape 10 to about 6 to 8 mm.The loading weight of the SAP 40 helps to provide the tape 10 with rapidwater absorption and to achieve a swelling ratio that provides a swellheight sufficient to permit the tape 10 to form a physical waterbarrier. The lack of adhesives and bonding agents used to form the tape10 can help to increase/maximize the swelling action of the SAP 40.

[0053] Referring to FIG. 2c, and with further reference to FIGS. 2a-2 b,in one embodiment, the first layer of nonwoven material 20 is bonded tothe second layer of the nonwoven material 30 in a pattern that isimprinted on the layers 20 and 30 using an ultrasonic bonding techniquewell known in the art. The technique can bond or fuse the first layer 20and the second layer 30 by impinging a surface of at least one of thefirst layer 20 and the second layer 30 with ultrasonic waves. As shownin FIG. 2c, in one embodiment, once the SAP 40 is disposed between thefirst and the second layers 20 and 30, ultrasonic waves 90 impinge afirst surface 50 a of the second layer 30, and a pattern 60 imprints afirst surface 80 a of the first layer 20 at about substantially the sametime as the first surface 50 a receives the ultrasonic waves 90. Thefirst layer 20 and the second layer 30 are essentially treatedsubstantially simultaneously to bond or fuse the layers 20 and 30 alongthe lines or marks of the pattern 60. In one embodiment, the pattern 60can imprint through the first and the second layer 20 and 30. In anotherembodiment, an area of the first surface 50 a of the second layer 30receiving ultrasonic waves is opposite to and substantially aligned withan area of the first surface 80 a of the first layer 20 being imprintedwith the pattern 60. As shown in FIG. 2b, in one embodiment, the pattern60 can traverse the width W3 of the first and the second layers 20 and30.

[0054] In one embodiment, the pattern 60 can include a repeating andsubstantially uniform pattern. In another embodiment, the pattern 60 caninclude an array of similar or dissimilar shapes. In a furtherembodiment, the pattern 60 may include an irregular or non-repeatingpattern. As shown in FIGS. 2a-2 b, in one embodiment, the pattern 60 caninclude an array of similar diamond shapes arranged in a repeating andsubstantially uniform pattern across the width W3 of the first andsecond layers 20 and 30. In one embodiment, each diamond shape canmeasure about 1.6 cm by 1.6 cm. Embodiments of the tape 10 according tothe invention are not limited to any particular type of the pattern 60.The invention anticipates the pattern 60 can include various shapes andsizes of shapes, as can be required by a certain application in whichthe tape 10 is used and/or to accommodate a desired loading weight ofthe SAP 40.

[0055] One feature and advantage of the tape 10 includes acompartmentalizing effect of the bonding pattern 60. Portions of the SAP40 are contained within shapes or configurations of the pattern 60 tothereby restrict movement of the SAP 40 between the layers 20 and 30.The pattern 60 helps to prevent concentration of the SAP 40 at pointsalong the tape 10 and, in particular, helps to prevent pooling of theSAP 40 along the edges 20 a, 30 a and 20 b, 30 b of the first and thesecond layers 20 and 30. In addition, the pattern 60 helps to facilitateand maintain a distribution of the SAP 40 between the layers 20 and 30that is substantially consistent, e.g., each shape or configuration ofthe pattern 60 contains approximately similar amounts of the SAP 40. Thesubstantially consistent distribution of the SAP 40 helps to produce aswell height or thickness of the tape 10 that is substantiallyconsistent, e.g., having little or no irregularities or inconsistenciesthat would affect water blocking performance of the tape 10, when theSAP 40 absorbs water and swells. The substantially consistent swellheight of the tape 10 helps to create a reliable and consistent barrierto help to prevent or to at least reduce the extent of water penetrationinto a cable core and water migration along a cable span.

[0056] In addition, the pattern 60 is one factor that can help toincrease/maximize a swell rate of the SAP 40 and a swell height of thetape 10. For example, if the pattern 60 is too tight, the volume ofindividual shapes or configurations of the pattern 60 will notaccommodate a swelling action of the SAP 40 and will not permit the SAP40 to swell freely nor at a swell rate sufficient to achieve a desiredswell ratio upon contact with water. In contrast, if the pattern 60 istoo loose, e.g., individual shapes or configurations are too large, theSAP 40 will not be compartmentalized and movement of the SAP 40 betweenthe layers 20 and 30 will cause pooling of the SAP 40 along the tape 10.In this instance, a swell height can be inconsistent and the tape 10 maynot form a substantially consistent and effective water barrier.

[0057] The bonding pattern 60 further provides a benefit of preventingor at least substantially reducing “fall-out” or loss of the SAP 40 fromthe tape 10 during cable manufacturing and stranding processes where thetape 30 is incorporated with one or more components of a cable or itscore. Reducing fall-out of the SAP 40 helps to retain a loading weightof the SAP 40 for sufficient water absorption and consistent swellheight.

[0058] Referring to FIG. 3, in one embodiment, the tape 10 according tothe invention 20 includes the first layer of nonwoven material 20 havingsubstantially the same dimensions, e.g., width, as the second layer ofnonwoven material 30 (not shown) such that longitudinal edges 20 a and20 b of the first layer 20 are substantially even with longitudinaledges 30 a and 30 b of the second layer 30. The layers 20 and 30 arebonded by the ultrasonic bonding technique described above. Ultrasonicwaves impinge the first surface 50 a of the second layer 30. A strip 70is imprinted on the first surface 80 a of the first layer 20 along thelongitudinal edges 20 a, 20 b, and 30 a, 30 b of the layers 20 and 30.The ultrasonic waves impinge the first surface 50 a of the second layer30 at substantially the same time as the strip is imprinted on the firstsurface 80 a of the first layer 20. The layers 20 and 30 are therebybonded or fused along the imprinted strips 70.

[0059] Referring to FIG. 4a, the invention provides a method 100 offorming the water blocking tape 10 and includes the stages shown. Themethod 100, however, is exemplary only and not limiting and can bealtered, e.g., by having stages added, removed or rearranged.

[0060] At stage 105, the first and the second layers 20 and 30 areprovided, e.g., each layer 20 and 30 including a sheet of nonwovenmaterial. Each layer 20 and 30 has desired dimensions, e.g., width, suchthat a desired number of the water blocking tapes 10 according to theinvention can be formed from the first and the second layers 20 and 30having desired dimensions.

[0061] At stage 110, at least one type of the SAP 40, e.g., in powderform, is applied, e.g., dusted, on one surface of one of the first layer20 and the second layer 30 at a loading weight sufficient to achieve adesired swell rate and/or a desired swell ratio required for aparticular application or a cable design in which one or more of thetapes 10 according to the invention will be used.

[0062] At stage 115, the second layer 30 is disposed on the first layer20 such that the SAP 40 is disposed between the layers 20 and 30.

[0063] At stage 120, ultrasonic waves, e.g., provided by an ultrasonichorn, impinge the first surface 50 a of the second layer 30 and thepattern 60, e.g., provided by a roller having a surface defining thepattern 60, imprints the first surface 80 a of the first layer 20substantially simultaneously as the ultrasonic waves impinge the firstsurface 50 a. The layers 20 and 30 are bonded therethrough to fuse thefirst layer 20 with the second layer 30 along the imprinted lines of thepattern 60. In one embodiment, an area of the second layer 30 impingedby the ultrasonic waves is substantially opposite to and aligned with anarea of the first layer 20 imprinted by the pattern.

[0064] At stage 125, the bonded layers 20 and 30 are slit into one ormore tapes 10 according to the invention using one or more conventionalcutting devices wherein each tape 10 has a desired width.

[0065] Referring to FIG. 4b, in one embodiment, the method 100 canfurther include stage 122 as an alternative to stage 125, as describedabove with reference to FIG. 4a. At stage 122, the bonded layers 20 and30 can be conveyed past an ultrasonic cutting device, including anultrasonic horn and one or more cutting devices to slit the layers 20and 30 into one or more strips or tapes 10 according to the invention.As the layers 20 and 30 are conveyed past the ultrasonic cutting device,the ultrasonic waves produced by the ultrasonic horn impinge a surfaceof one of the layers 20 and 30 and one or more of the cutting devicescontacts an opposite surface of one of the layers 20 and 30. The layers20 and 30 are slit into multiple strips or tapes 10 when the ultrasonicwaves impinge the surface and one or more of the cutting devices contactthe opposite surface. In one embodiment, the ultrasonic waves impingethe surface substantially simultaneously or at the same time as the oneor more cutting devices contacts the opposite surface. In oneembodiment, an area of the surface of one of the layers 20 and 30impinged by the ultrasonic waves is substantially opposite to andaligned with an area of the opposite surface of one of the layers 20 and30. In one embodiment, the one or more cutting devices may be equallyspaced apart to slit the layers 20 and 30 into one or more tapes 30having substantially equal width. In another embodiment, the layers 20and 30 have substantially similar dimensions, e.g., width, andlongitudinal edges of the first layer 20 are substantially even withlongitudinal edges of the second layer 30.

[0066] Referring to FIG. 5, in another aspect, the invention provides asystem 200 and a method for forming the water blocking tape 10 in acontinuous in-line process using ultrasonic bonding and ultrasoniccutting techniques to form the tape 10 according to the invention. Asshown in FIG. 5, at least a first feed roller 201, on which a nonwovenmaterial having a desired width is wound, supplies the first layer ofnonwoven material 20 to a production line 205. At least a second feedroller 202, on which a nonwoven material having a desired width iswound, supplies the second layer of nonwoven material 30 to theproduction line 205.

[0067] In one embodiment, the second feed roller 202 can be associatedwith a set of one or more idler rollers 203 that help to convey thesecond layer 30 from the roller 202 to the line 205. The idler rollers203 can be placed proximate to the roller 202 to receive the secondlayer 30. The second feed roller 202 is associated with a set of one ormore take-up rollers 260 and 270 disposed downstream from the feedroller 202 to help to convey the second layer 30 through the line 205,e.g., in a substantially horizontal orientation and with a sufficienttautness. As shown in FIG. 5, the first feed roller 201 is associatedwith the set of one or more take-up rollers 260 and 270 disposeddownstream from the roller 201 to help to convey the first layer 20through the line 205, e.g., in a substantially horizontal orientationand with a sufficient tautness.

[0068] In one embodiment, the second feed roller 202 can be furtherassociated with one or more ancillary rollers 204 disposed to help tosupply the layer of shielding material 35 to the line 205. As shown inFIG. 5, the ancillary roller 204 is disposed and configured such that itcan feed the layer of shielding material 35 to one of the idler rollers203. The idler roller 203 can then feed the second layer 30 and thelayer of shielding material 35 to the production line 205.

[0069] The system 200 and method according to the invention is notlimited to the arrangement and association of the feed rollers 201 and202, the idler rollers 203, the ancillary roller 204 and the take-uprollers 206 and 207 as shown in FIG. 5, and anticipates differentarrangements and associations of rollers to supply the first and thesecond layers 30 and 20 into the production line 205 and to convey thefirst and the second layers 30 through the product line 205, as well asto feed and convey the layer of shielding material 35 into and throughthe production line 205.

[0070] The system 200 further includes a dispenser 210 to dispense theSAP 40. In one embodiment, the dispenser 210 is disposed downstream fromthe first feed roller 201, e.g., above the production line 205, suchthat when the first layer 20 is conveyed along the line 205, e.g., in asubstantially horizontal orientation, the dispenser 210 dispenses theSAP 40 to a surface of the first layer 20. In one embodiment, thedispenser 210 can include any device well known in the art fordispensing such material, e.g., a powder form of the SAP 40, and can beconfigured to confine the SAP 40 during dusting. In one embodiment, thedispenser 210 can include a housing 220 (shown in phantom) in which anegative pressure vacuum is created to contain and to localize the SAP40 during dispensing. The housing 220 can include a pressure sensorand/or an indicator to detect and to display an internal pressure withinthe housing 220.

[0071] As the first layer 20 is conveyed past the dispenser 210, thedispenser 210 dusts the first surface 80 a of the first layer 20 withthe SAP 40 at a desired loading weight, e.g., from about 10 gsm to about50 gsm and preferably about 20 gsm. In one embodiment, the first layer20 can be ionized by an appropriate method known in the art, before orduring dispensing of the SAP 40 on the first surface 80 a.

[0072] The second feed roller 202 and/or one or more of the idlerrollers 203 help to feed the 20 second layer 30 into the line 205, e.g.,at a site 225 in the production line 205 where the second layer 30 isconveyed downstream from the dispenser 210. In one embodiment, theancillary roller 204 feeds the layer of shielding material 35 into oneof the idler rollers 203, and the idler roller 203 feeds the secondlayer 30 and the layer of shielding material 35 into the production line205. The second layer 30 is conveyed along the line 205, e.g., in asubstantially horizontal orientation, opposite and parallel to the firstlayer 20. During conveyance, the second layer 30 eventually becomesdisposed on the first surface 80 a of the first layer 20. In oneembodiment, where the idler 203 also feeds the layer of shieldingmaterial 35 into the production line 205, the layer of shieldingmaterial 35 and the second layer 30 are substantially opposite andparallel to one another, and are substantially opposite and parallel tothe first layer 20. During conveyance, the layer of shielding material35 and the second layer 30 eventually become disposed on the firstsurface 80 a of the first layer 20.

[0073] In one embodiment, each of the layers 20 and 30 has asubstantially similar width to the other layer 20 and 30 such that whenthe second layer 30 is disposed on the first surface 80 a of the firstlayer 20 as the layers 20 and 30 are conveyed in the production line205, longitudinal edges of the first and second layers 20 and 30 aresubstantially aligned or even. In one embodiment, the layer of shieldingmaterial 35 has a similar width to one or both of the layers 20 and 30such that when the layer of shielding material 35 is disposed on thesecond layer 30 as the layers 20 and 30 are conveyed in the productionline 205, longitudinal edges of the layer of shielding material 35 andthe first and/or the second layer 30 are substantially aligned or even.The first and second layers 20 and 30 and, optionally, the layer ofshielding material 35, thereby form a continuous web 300 that isconveyed through the system 200 in the line 205.

[0074] The system 200 further includes an ultrasonic lamination deviceincluding an ultrasonic horn 230 and an anvil roller 235. The ultrasonichorn 230 and the anvil roller 235 are disposed downstream from thedispenser 210. The ultrasonic horn 230 and the roller 235 are spacedfrom the production line 205 and disposed on opposite sides of theproduction line 205 such that the web 300 is conveyed in the productionline 205 between the ultrasonic horn 230 and the roller 235. In oneembodiment, the ultrasonic horn 230 and the roller 235 are disposed onopposite sides of the production line 205 and are in alignment such thatthe web 300 is conveyed by the ultrasonic horn 230 and by the roller 235at about substantially the same time. In one embodiment, the ultrasonichorn 230 is disposed above the production line 205 and verticallyaligned with the roller 235 disposed below the line 205. In thisembodiment, when the web 300 is conveyed between the ultrasonic horn 230and the anvil roller 235, the web is conveyed in a substantiallyhorizontal orientation.

[0075] The invention is not limited to the arrangement and associationof the ultrasonic horn 230 and the roller 235 as shown in FIG. 5 andanticipates other arrangements and associations between the ultrasonichorn 230 and the roller 235.

[0076] A surface of the roller 235 defines a pattern 240. The roller 235imprints the pattern 240 on a second surface 80 b of the first layer 20when the roller 235 contacts the first layer 20 as it is conveyedthrough the line 205. In different embodiments, the pattern 240 caninclude any pattern that is desired to contain and/or tocompartmentalize the SAP 40 between the first and the second layers 20and 30. In one embodiment, the pattern 240 includes a repeating andsubstantially uniform pattern. In another embodiment, the pattern 240includes an array of similar or dissimilar shapes. In a furtherembodiment, the pattern 240 includes an array of substantially similardiamond shapes and each diamond shape about 1.6 cm by 1.6 cm. In stillanother embodiment, the pattern 240 includes a non-repeating orirregular pattern. The roller 235 can include, for instance, acylindrical shaped roller having a circular cross-section constructed ofa material suitable for imprinting, such as, although not limited tometal, e.g., steel or chrome-plated steel.

[0077] The ultrasonic horn 230 can include any device well known in theart for producing ultrasonic waves. In one embodiment, the ultrasonichorn 230 is a device commercially available under the name and modelnumber of Ultra Sonic Generator, 2 DPC Level 2 1200w, available fromDukane, St. Charles, Ill.

[0078] As shown in FIG. 5, the web 300 is conveyed in the productionline 205 between the ultrasonic horn 230 and 30 the roller 235. Theultrasonic horn 230 emits ultrasonic waves such that as the web 300 isconveyed by the horn 230, ultrasonic waves impinge a first surface 300 aof the web 300 that faces the horn 230. As the web 300 is conveyed inthe production line 205 and by the roller 235, the roller 235 contacts asecond surface 300 b of the web 300 opposite to the first surface 300 bthat faces the roller 235. Contact of the roller 235 to the secondsurface 300 b of the web 300 thereby imprints the pattern 240 across thesecond surface 300 b of the web 300.

[0079] In one embodiment, as the web 300 is conveyed between theultrasonic horn 230 and the roller 235, ultrasonic waves impinge a firstarea of the first surface 300 a of the web 300 that is substantiallyopposite to a second area of the second surface 300 b that the roller235 contacts and imprints the pattern 240 thereon. The ultrasonic wavesimpinge the first area of the first surface 300 a at substantially thesame time as the roller 235 contacts and imprints the pattern 240 on thesecond surface 300 b. The first and the second layers 20 and 30 arethereby bonded along the pattern 240 as a result of ultrasonic wavesimpinging the first area of the first surface 300 a at substantially thesame time as the printer 235 imprints the pattern 240 on the second areaof the second surface 300 b. The roller imprints the pattern 240 on thesecond surface 300 b through the second layer 30 and through the firstlayer 20 when ultrasonic waves impinge the first surface 300 a to bondthe layers 20 and 30 along the pattern 240.

[0080] In one embodiment, the layers 20 and 30 are bonded along thepattern 240 substantially across the first area and the second area ofthe first and second surfaces 300 a and 300 b of the web 300. In oneembodiment, the web 300 is conveyed continuously in the line 205 suchthat the ultrasonic waves continuously impinge the first surface 300 aof the web 300 and the roller 235 continuously imprints the pattern 240on the second surface 300 b of the web 300 such that the first and thesecond layers 20 and 30 are continuously ultrasonically bonded along thepattern 240.

[0081] The system 200 further includes an ultrasonic cutting deviceincluding an ultrasonic horn 250 and one or more cutting devices 255,e.g., cutting anvils. The ultrasonic horn 250 and the cutting anvils 255are disposed downstream from the ultrasonic lamination device 230 and235. The ultrasonic horn 250 and the cutting anvils 255 are spaced fromthe production line 205 and disposed on opposite sides of the productionline 205 such that the web 300 is conveyed in the production line 205between the ultrasonic horn 250 and the cutting anvils 255. In oneembodiment, the ultrasonic horn 250 and the cutting anvils 255 aredisposed on opposite sides of the production line 205 and are inalignment such that the web 300 is conveyed by the ultrasonic horn 250and by the cutting anvils 255 at about substantially the same time. Inone embodiment, the ultrasonic horn 250 is disposed above the productionline 205 and vertically aligned with one or more of the cutting anvils255 disposed below the line 205. In this embodiment, when the web 300 isconveyed between the ultrasonic horn 250 and the cutting anvils 255, theweb is conveyed in a substantially horizontal orientation

[0082] The invention is not limited to the arrangement and associationof the ultrasonic horn 250 and the cutting anvils 255, as shown in FIG.5 and anticipates other arrangements and associations between theultrasonic horn 250 and the cutting anvils 255.

[0083] The ultrasonic horn 250 can include any device well known in theart for producing ultrasonic waves. In one embodiment, the ultrasonichorn 250 is a device commercially available under the name and modelnumber of Ultra Sonic Generator, 2 DPC Level 2 1200w, available fromDukane, St. Charles, Ill.

[0084] As shown in FIG. 5, the web 300 is conveyed in the productionline 205 between the ultrasonic horn 250 and the cutting anvils 255. Asthe web 300 is conveyed between the ultrasonic horn 250 and the cuttinganvils 255, the ultrasonic horn 250 emits ultrasonic waves such that asthe web 300 is conveyed by the horn 250, ultrasonic waves impinge thefirst surface 300 a of the web 300 that faces the horn 250. As the web300 is conveyed in the production line 205 and by the cutting anvils255, one or more of the cutting anvils 255 contacts the second surface300 b of the web 300 opposite to the first surface 300 b that faces oneor more of the cutting anvils 255. Contact of one or more of the cuttinganvils 255 to the second surface 300 b of the web 300 thereby slits orcuts the web 300 therethrough.

[0085] In one embodiment, as the web 300 is conveyed between theultrasonic horn 250 and the cutting anvils 255, ultrasonic waves impingethe first area of the first surface 300 a of the web 300 that issubstantially opposite to the second area of the second surface 300 bthat one or more of the cutting anvils 255 contacts. The ultrasonicwaves impinge the first area of the first surface 300 a at substantiallythe same time as one or more of the cutting anvils 255 contacts and slitor cuts the second surface 300 b through the second layer 30 and thenthrough the first layer 20. The web 300 is thereby slit into two or morestrips as a result of ultrasonic waves impinging the first area of thefirst surface 300 a at substantially the same time as one or more of thecutting anvils 255 slits the second area and the web 300 therethrough.The number of strips into which the web 300 is slit depends on a numberof the cutting anvils 255. In one embodiment, the web 300 is conveyedcontinuously in the line 205 such that the ultrasonic device 250 emitsultrasonic waves that continuously impinge the first surface 300 a ofthe web 300 and the cutting anvils 255 continuously slit or cut the web300 therethrough such that two or more strips are produced continuously.

[0086] As can be appreciated by those skilled in the art, the widths ofthe first layer 20 and the second layer 30 and the number and positionof the cutting anvils 255 can determine the number and width of thestrips or tapes 10 slit from the web 300 in a single production run asthe web 300 is continuously conveyed through the system 200. In oneembodiment, the cutting anvils 255 can be arranged to slit strips ortapes 10 having different widths to thereby produce a number of tapes 10for more than one application or cable design.

[0087] As shown in FIG. 5, the system 200 includes the take-up rollers260 and 270 disposed downstream from the ultrasonic cutting device 250and 255 to remove the strips or tapes 10 from the line 205 and to windthe tapes 10 thereto.

[0088] Referring to FIGS. 6-8, further embodiments of the inventionprovide other multilayer forms or substrates other than multilayer tapedescribed above within which one or more compounds are contained andmethods for making same. Such multilayer forms or substrates can definevarious lengths, widths and/or shapes and configurations required ordesired for any of a variety of applications. The invention is therebynot limited to a multilayer nonwoven water-absorbing tape andanticipates that other multilayer forms or substrates can be formedaccording to the invention within which one or more compounds arecontained that provide one or more physical properties orcharacteristics other than water-absorption properties.

[0089] As used herein, the term “form” or “substrate” refers to anymultilayer configuration that is formed using the ultrasonic bondingtechnique(s) of the method 100 or the system 200 described above, or amethod 900 as described below with reference to FIGS. 9a and 9 b, andincludes at least one compound disposed between one or more layers ofmaterial. Such terms further refer to any multilayer configurationdefining any length, width and/or shape or configuration.

[0090] As shown in FIG. 6, the invention provides a multilayer substrateor form 10 a comprised of one or more layers of material 20 a and 30 aand one or more compounds 91 disposed between at least two of the layers20 a and 30 a, wherein the one or more compounds 91 provide one or morerequired or desired physical properties or characteristics. Forinstance, the one or more compounds 91 can display or provide one ormore physical properties or characteristics including, but not limitedto, absorbent properties, such as odor absorption and moisture or waterabsorption abilities, olfactory properties, such as fragrant, aromaticand redolent qualities and scent or bouquet-emitting characteristics,thermal properties, such as heat capacities to absorb or transfer heator heat emitting and thermal insulating properties, repellentproperties, and any other physical properties or characteristics thatnon-fluid dry compounds or non-fluid semi-solid or moist compounds canprovide.

[0091] In one aspect of the invention, non-fluid dry compounds 91 caninclude granular or particulate compounds, powders, finely-dividedmaterials, or combinations thereof, such as, although not limited to,odor-absorbing compounds, e.g., sodium bicarbonate, fragrance compounds,desiccants, salts or charcoal. For example, the form 10 a according tothe invention can include one or more desiccants 91 disposed between thefirst and the second layers 20 a and 30 a to provide an encased orencapsulated desiccant for use in a variety of applications in whichhumidity control or reduction is desired or required.

[0092] In another aspect of the invention, non-fluid semi-solid or moistcompounds can include pastes, gels, waxes, or combinations thereof, suchas, although not limited to, silica gels. For example, the form 10 aaccording to the invention can include one or more semi-solid gels orwaxes that emit a required or desired fragrance or scent, e.g., to serveas an air freshener.

[0093] The invention is not limited to any specific non-fluid compoundand/or physical property or characteristic, and envisions that othernon-fluid compounds are within the scope of the invention to provide themultilayer form 10 a as disclosed.

[0094] Still referring to FIG. 6, the invention provides a multilayerform 10 a comprised of one or more layers of material, e.g., nonwoven,and one or more non-fluid compounds 91, as described above. Themultilayer form 10 a can be constructed similar to the tape 10 describedabove with reference to FIG. 1a and FIGS. 2a and 2 b and as describedbelow. The form 10 a can include a first layer 20 a of nonwoven materialdisposed on a second layer 30 a layer of nonwoven material with one ormore compounds 91 disposed therebetween. In addition, the first and thesecond layers 20 a and 30 a can be bonded along a pattern 92 using anultrasonic bonding technique, such as any of the ultrasonic bondingtechnique(s) described above with reference to FIG. 2c, FIGS. 4a and 4 band FIG. 5 and as described below. The ultrasonic bonding pattern 92bonds or fuses the layers 20 a and 30 a and helps to contain thecompound(s) 91 disposed between the layers 20 a and 30 a. Further, thepattern 92 can be configured to help to compartmentalize the compound(s)91 such that movement of the compound(s) 91 between the layers 20 a and30 a can be restrained or at least minimized, e.g., the compound(s) 91does not migrate to and/or collect along edges and/or other areas of theform 10 a, and distribution of the compound(s) 91 between the layers 20a and 30 a can be maintained or remain at least relatively consistent,e.g., the compound(s) 91 remains distributed across portions of thelength and/or the width defined by the form 10 a. Other embodiments ofthe form 10 a are within the scope of the invention.

[0095] As shown in FIG. 6, the multilayer form 10 a includes at leastthe first layer 20 a of nonwoven material and at least the second layer30 a of nonwoven material with the compound(s) 91 having one or moredesired or required physical properties or characteristics disposedtherebetween. In some embodiments of the form 10 a according to theinvention, the first and the second layers 20 a and 30 a can beconstructed of a nonwoven material that will not add significant weightto an article to which the form 10 a is disposed on or incorporatedwith. In other embodiments of the invention, the first and the secondlayers 20 a and 30 a can be constructed of a nonwoven material that iscomparatively inexpensive and/or demonstrates a degree of flexibility topermit use of the form 10 a with any of a variety of articles. Infurther embodiments of the invention, the first and the second layers 20a and 30 a can be constructed of a nonwoven material that demonstrates ahigh tensile strength and/or has a low porosity. The first and thesecond layers 20 a and 30 a can be constructed of a nonwoven materialthat provides has one or more properties or characteristics required ordesired for a particular application in which the multilayer form 10 awill be used. A nonwoven material suitable for use in constructing theform 10 a according to the invention can include, but is not limited to,a spun bonded nonwoven, e.g., spun bonded polyester, a spun bonded meltblown spun bonded (SMS) nonwoven, e.g., SMS polypropylene, a spun bondedmelt blown melt blown spun bonded (SMMS) nonwoven, a melt blownnonwoven, a spun bonded nonwoven, e.g., spun bonded polyurethane, aplastic, a nonwoven nylon, a nonwoven polypropylene, a nonwovenpolyester, e.g., polyethylene terephthlate (PET), a carded nonwoven, andany combinations thereof. The invention is not limited to any specificnonwoven material, and envisions that other materials can be used toconstruct the first and the second layers 20 a and 30 a.

[0096] The compound(s) 91 are disposed, for instance, on one of a firstsurface of the first layer 20 a and a first surface of the second layer30 a. Thereafter, one of the first layer 20 a and the second layer 30 ais disposed on the one or more compounds 91 such that the compounds 91are disposed between the layers 20 a and 30 a.

[0097] The compound(s) 91 can be disposed at a loading weight within arange that is conducive to a particular compound 91 and/or a particularapplication in which the form 10 a is used, and/or that helps to providethe one or more required or desired physical properties orcharacteristics. In some embodiments of the invention, the compound(s)can be disposed at a loading weight of from about 1 gram per squaremeter (gsm) to about 200 (gsm), although the invention is not limited tothis range and envisions that the compound(s) 91 can be disposed at aloading weight within other ranges to produce the multilayer form 10 aaccording to the invention.

[0098] Referring to FIGS. 7 and 8, and with further reference to FIG. 6,when the first layer 20 a is disposed on the second layer 30 a and thecompound(s) 91 are disposed therebetween, the first and the secondlayers 20 a and 30 a are bonded along the pattern 92. As shown in FIG.8, in one embodiment, the pattern 92 can include a plurality of lines.The plurality of lines can define the pattern 92 as a non-uniformpattern, or can define the pattern 92 as a substantially uniform patternthat repeats one or more designs, shapes or configurations. In oneembodiment, the plurality of lines of the pattern 92 can define one ormore shapes or configurations that each defines a volume between thefirst and the second layers 20 a and 30 a sufficient to contain anamount of the compound(s) 91. In a further embodiment, each of the oneor more shapes or configurations can be similarly sized and can repeatin a substantially uniform pattern. In another embodiment, each of theone or more shapes or configurations can define a volume between thefirst and the second layers 20 a and 30 a such that movement of anamount of the compound(s) 91 contained between the first and the secondlayers 20 a and 30 a is restrained or at least minimized, and/ordistribution of the one or more compounds 91 between the layers 20 a and30 a is ensured and maintained, as defined above.

[0099] In one embodiment, the first and the second layers 20 a and 30 aare bonded or fused using an ultrasonic bonding technique similar to theultrasonic bonding technique described above with reference to FIG. 2c.As shown in FIG. 7, the first layer 20 a can be bonded to the secondlayer 30 a as a result of ultrasonic waves 95 impinging an outer surface93 of the second layer 30 a, while means 96 to print the pattern 92contacts an outer surface 94 of the first layer 20 a. In one embodiment,the ultrasonic waves 95 impinge the outer surface 93 of the second layer30 a simultaneously, or at about a substantially same time, as means 96to print the pattern 92 contacts the outer surface 94 of the first layer20 a such that the first and the second layers 20 a and 30 a areultrasonically bonded along the printed pattern 92. In a furtherembodiment, portions of the outer surfaces 93 and 94 receivingultrasonic waves or printing means are substantially opposite andaligned, as shown in FIG. 7.

[0100] Referring to 9 a, the invention provides a method 900 of formingthe multilayer form 10 a and includes the stages shown. The method 900,however, is exemplary only and not limiting and can be modified oraltered, e.g., by having stages added, removed or rearranged.

[0101] At stage 905, the first and the second layers 20 a and 30 a areprovided, e.g., each layer 20 a and 30 a including a sheet of nonwovenmaterial defining required or desired dimensions, e.g., a length and/ora width, required or desired for a particular application in which theform 10 a is to be used and/or required or desired for the compound(s)91 to provide one or more physical properties or characteristics.

[0102] At stage 910, at least one compound 91, e.g., in powder form, isapplied, e.g., dusted, on one surface of either the first layer 20 a orthe second layer 30 a at a loading weight sufficient to achieve arequired or desired property or characteristic when the form 10 a iscompleted and disposed in a particular application. In another aspect,the compound(s) 91 can be loaded at a weight conducive to theapplication and/or the type of compound(s) 91.

[0103] At stage 915, the second layer 30 a is disposed on the firstlayer 20 a such that the compound 91 is disposed between the layers 20 aand 30 a.

[0104] At stage 920, ultrasonic waves, e.g., provided by an ultrasonichorn, impinge the outer surface 93 of the second layer 30 a and thepattern 92, e.g., provided by a roller having a surface defining thepattern 92 that contacts the form 10 a, imprints the outer surface 94 ofthe first layer 20 substantially simultaneously as the ultrasonic wavesimpinge the outer surface 93 of the second layer 30 a. The layers 20 aand 30 a are thereby bonded therethrough along the imprinted lines ofthe pattern 60. In one embodiment, an area of the second layer 30 aimpinged by the ultrasonic waves is substantially opposite to andaligned with an area of the first layer 20 a imprinted by the pattern93.

[0105] The bonded layers 20 a and 30 b can be further processed, e.g.,cut or slit, to form or configure the bonded layers 20 a and 30 b intoone or more multilayer forms 10 a that defines dimensions, a size and/ora configuration, as required or desired.

[0106] Referring to FIG. 9b, the method 900 according to the inventioncan further include stage 925 in addition to those stages described withreference to FIG. 9a. At stage 925, the bonded layers 20 a and 30 a canbe disposed in relation to, e.g., conveyed past, an ultrasonic cuttingdevice, including an ultrasonic horn and one or more cutting devices tocut or slit the layers 20 a and 30 a into one or more forms 10 aaccording to the invention. As the layers 20 a and 30 a are conveyedpast the ultrasonic cutting device, the ultrasonic waves produced by theultrasonic horn impinge an outer surface of either one of the layers 20a and 30 a and one or more of the cutting devices contacts an oppositeouter surface of the other of the layers 20 a and 30 a, similar to theimpingement of the ultrasonic waves to the outer surfaces of the layers20 a and 30 a described and shown in reference to FIGS. 7 and 9a. Thelayers 20 a and 30 a are thereby cut or slit into one or more multilayerforms 10 a when the ultrasonic waves impinge the outer surface and oneor more of the cutting devices contact the opposite outer surface. Inone aspect of the method 900, the ultrasonic waves impinge the outersurface substantially simultaneously or at the same time as the one ormore cutting devices contacts the opposite outer surface. In anotheraspect of the method 900, an area of the outer surface along one of thelayers 20 and 30 impinged by the ultrasonic waves is substantiallyopposite to and aligned with an area along the opposite outer surface ofone of the layers 20 and 30. In further aspect of the method 900, theone or more cutting devices may be equally spaced apart to cut or slitthe layers 20 a and 30 a into one or more forms 10 a havingsubstantially equal width. In yet another aspect of the method 900, thelayers 20 a and 30 a have substantially similar dimensions, e.g., width,and longitudinal edges of the first layer 20 a are substantially evenwith longitudinal edges of the second layer 30 a.

[0107] In one aspect, the method 900 according to the invention asdescribed with reference to FIGS. 9a and 9 b can be implemented via thesystem 200 described above with reference to FIG. 5 such that one ormore multilayer forms 10 a according to the invention can be producedthrough an on-line production process.

[0108] Other embodiments of the invention are envisioned. For example,the form 10 a can include, in addition to the first and the secondlayers of material 20 a and 30 a, one or more additional layers ofmaterial disposed on one or both of the outer surfaces of the first andsecond layers 20 a and 30 a. In addition, the compound(s) 91 can befurther disposed between one or both of the first and second layers 20 aand 30 a and the additional layers of material disposed on the outersurfaces such that the form 10 a can provide multiple layers of materialwith the compound(s) 91 disposed between adjacent pairs of materiallayers. The ultrasonic bonding and cutting techniques as describedherein can be used to further process the form 10 a to form one or moremultilayer forms 10 a according to the invention. Having thus describedat least one illustrative embodiment of the invention, variousalterations, modifications and improvements will readily occur to thoseskilled in the art. Such alterations, modifications and improvements areintended to be within the scope and spirit of the invention.Accordingly, the foregoing description is by way of example only and isnot intended as limiting. The invention's limit is defined only in thefollowing claims and the equivalents thereto.

[0109] Having thus described at least one illustrative embodiment of theinvention, various alterations, modifications and improvements willreadily occur to those skilled in the art. Such alterations,modifications and improvements are intended to be within the scope andspirit of the invention. Accordingly, the foregoing description is byway of example only and is not intended as limiting. The invention'slimit is defined only in the following claims and the equivalentsthereto.

What is claimed is:
 1. A multilayer form comprising: at least a firstlayer of material; at least one non-fluid compound disposed on a surfaceof the first layer of material; at least a second layer of materialdisposed on the non-fluid compound such that the non-fluid compound isdisposed between the first layer and the second layer of material; andthe first and the second layer of material being ultrasonically bondedalong a pattern, the pattern traversing at least a portion of an outersurface of the first layer and at least a portion of an outer surface ofthe second layer of material when bonded such that movement of thenon-fluid compound between the first layer and the second layer ofmaterial is restrained.
 2. The tape of claim 1 wherein the patternincludes a plurality of lines.
 3. The tape of claim 2 wherein theplurality of lines defines one or more shapes.
 4. The tape of claim 3wherein each of the one or more shapes defines a volume to contain anamount of the at least one non-fluid compound.
 5. The tape of claim 2wherein the pattern includes a repeating and substantially uniformpattern such that the plurality of lines defines a plurality ofsubstantially similar shapes.
 6. The tape of claim 5 wherein each of theplurality of substantially similar shapes defines a volume to contain anamount of the at least one non-fluid compound.
 7. The tape of claim 6wherein each shape defines a substantially similar volume to contain asubstantially similar amount of the at least one non-fluid compound. 8.The tape of claim 1 wherein the first layer of material definessubstantially similar dimensions as the second layer of materialdefines.
 9. The tape of claim 1 wherein one of the first layer ofmaterial and the second layer of material includes a layer of nonwovenmaterial.
 10. The tape of claim 10 wherein the layer of nonwovenmaterial includes a layer of material selected from the group consistingof a spun bonded nonwoven fabric, a spun bonded melt blown spun bondednonwoven fabric, a spun bonded melt blown melt blown spun bondednonwoven fabric, a melt blown nonwoven fabric, a nonwoven nylon, acarded nonwoven fabric, a plastic, a polyester polyethyleneterephthlate, and combinations thereof.
 11. The tape of claim 1 whereinthe at least one non-fluid compound is selected from the groupconsisting of granular compounds, particulate compound, powders, finelydivided materials, and combinations thereof.
 12. The tape of claim 1wherein the at least one non-fluid compound is selected from the groupconsisting of moist compounds, moist pastes, semi-solid compounds, gels,waxes, and combinations thereof.
 13. A method of forming a multilayerform comprising: providing at least a first sheet of material;dispensing an amount of at least one non-fluid compound on a surface ofthe first sheet of material; providing at least a second sheet ofmaterial and disposing the second sheet of material on the surface ofthe first sheet of material such that the at least one non-fluidcompound is disposed between the first and the second sheets of materialto form a web; impinging at least a portion of a first outer surface ofthe web with ultrasonic waves; and printing a pattern on at least aportion of a second outer surface of the web such that the first and thesecond sheets of material are bonded along the pattern.
 14. The methodof claim 13 wherein the first sheet and the second sheets of materialare bonded therethrough along the pattern.
 15. The method of claim 13wherein the pattern traverses at least a portion of a width the webdefines.
 16. The method of claim 13 wherein the pattern includes aplurality of lines.
 17. The method of claim 16 wherein the plurality oflines defines one or more shapes.
 18. The method of claim 17 whereineach of the one or more shapes defines a volume to contain a portion ofthe at least one non-fluid compound such that movement of the at leastone non-fluid compound between the first and the second layers ofmaterial is restrained.
 19. The method of claim 16 wherein the pluralityof lines defines a repeating and substantially uniform pattern ofsimilar shapes.
 20. The method of claim 13 wherein impinging the portionof the first outer surface of the web with ultrasonic waves includesimpinging the portion at about substantially a same time as printing thepattern on the portion of the second outer surface of the web.
 21. Themethod of claim 20 wherein the portion of the first outer surface andthe portion of the second outer surface of the web are substantiallyopposite one another and aligned.
 22. The method of claim 13 furthercomprising impinging at least a portion of the first outer surface ofthe web with ultrasonic waves and contacting at least a portion of thesecond outer surface of the web with one or more cutting devices suchthat the cutting devices cut the web therethrough into one or moremultilayer forms.
 23. The method of claim 22 wherein impinging theportion of the first outer surface of the web with ultrasonic wavesincludes impinging the portion at about substantially a same time as theone or more cutting devices contact the portion of the second outersurface of the web.
 24. The method of claim 23 wherein the portion ofthe first outer surface and the portion of the second outer surface ofthe web are substantially opposite one another and aligned.